LOCTITE ECCOBOND UF 3808
Beschreibung:
UF3808
Details:
LOCTITE ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
- High Tg
- Reworkable
- Low CTE
- Room temperature flow capability
- High Tg
- Reworkable
- Low CTE
- Room temperature flow capability
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 365 d
Verkaufseinheit:
STK
