LOCTITE ECCOBOND UF 3808

LOCTITE ECCOBOND UF 3808 is a one-component, halogen-free epoxy capillary underfill material designed to cure rapidly at low temperatures, thereby minimizing stress on surrounding components.
Once cured, it provides excellent mechanical properties to protect solder joints during thermal cycling stress.
It is compatible with most lead-free solders and delivers stable electrical performance, even in high-humidity environments.

Capillary underfill material – protects solder joints during thermal cycling stress

- High glass transition temperature (Tg)
- Reworkable
- Low coefficient of thermal expansion (CTE)
- Room-temperature flow capability
- One-component: no mixing required

Dry Ice Shipment, Shelf Life: 365 d