LOCTITE ECCOBOND E 1172 A
LOCTITE ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25 micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.
- Low cure temperature
- For use with very fine area array devices with 25 µm geometries where transparent processing is critical
- Minimizes induced stress at the solder joint to improve thermal cycling performance
- Fast cure at low temperatures
Dry Ice Shipment, Shelf Life: 183 d