LOCTITE ECCOBOND E 1172 A

ECCOBOND E 1172 A

LOCTITE ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.This product cures fast at low temperatures and exhibits low CTE with long pot life.

- Void free underfill
- Single component
- Long pot life
- Fast Cure

Dry Ice Shipment, Shelf Life: 183 d

STK