LOCTITE ECCOBOND E 1172 A

LOCTITE ECCOBOND E 1172 A is a void-free, epoxy-based underfill encapsulant designed for use on very fine area array devices where SMT transparent processing is critical. It can be used on flip chip devices with as small as 25-micron geometries. When applied, it provides a uniform encapsulation with a strong adhesive force, maximising the device’s temperature cycling capability by distributing stress away from solder connections.

Void-free underfill for very fine area array devices

Dry Ice Shipment, Shelf Life: 183 d

STK