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LOCTITE ECCOBOND E 1172 A

Beschreibung:

ECCOBOND E 1172 A



Details:
LOCTITE ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25 micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.

- Low cure temperature
- For use with very fine area array devices with 25 µm geometries where transparent processing is critical
- Minimizes induced stress at the solder joint to improve thermal cycling performance
- Fast cure at low temperatures
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 183 d
Verkaufseinheit:
STK
Auswahl zurücksetzen
Menge: