LOCTITE ECCOBOND E 1172 A
Description:
ECCOBOND E 1172 A
Détails:
LOCTITE ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.This product cures fast at low temperatures and exhibits low CTE with long pot life.
- Void free underfill
- Single component
- Long pot life
- Fast Cure
- Void free underfill
- Single component
- Long pot life
- Fast Cure
Détails d'emballage:
Dry Ice Shipment, Shelf Life: 183 d
Unité de vente:
STK