LOCTITE ABLESTIK 84-1LMI

When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.

Electrically conductive adhesive designed for microelectronic chip bonding applications

- Electrically conductive
- Low bleed
- Low outgassing

Dry Ice Shipment, Shelf Life: 365 d

STK