LOCTITE ABLESTIK 84-1LMI
Description:
ABLEBOND 84-1LMI
Details:
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
Electrically conductive adhesive designed for microelectronic chip bonding applications
- Electrically conductive
- Low bleed
- Low outgassing
Electrically conductive adhesive designed for microelectronic chip bonding applications
- Electrically conductive
- Low bleed
- Low outgassing
Packaging details:
Dry Ice Shipment, Shelf Life: 365 d
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