LOCTITE ABLESTIK 550K-1-006

LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding
- High thermal conductivity
- Low cure temperature
- Suitable for an array of difficult-to-bond substrates

Bitte die unbedingt die "Material Handling Instruction" auf der Verpackung beachten:
- Allow the material to reach room temperature before use.
- Do not open packaging until the material has fully thawed.

Dry Ice Shipment, Shelf Life: 365 d

STK