LOCTITE ECCOBOND UF 8830S

LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.

- Improved toughness
- Low CTE
- High purity
- High TG

Dry Ice Shipment, Shelf Life: 365 d

STK