LOCTITE ECCOBOND UF 1173

LOCTITE® ECCOBOND UF 1173 is a 1-part, epoxy-based underfill, which maximises the device’s temperature cycling capability, distributing stress away from solder connectors and thus enhancing solder joint reliability in Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It has a long pot life and exhibits low CTE properties to improve bond strength and stability. Ideal for void-free encapsulation of electronic packages.

Void-free epoxy underfill

Dry Ice Shipment, Shelf Life: 180 d