LOCTITE ECCOBOND NCP 5209

LOCTITE® ECCOBOND NCP 5209 is a pale yellow, non-conductive, acrylate-based die attach adhesive designed for demanding flip-chip copper pillar applications. It utilizes thermal compression bonding to provide robust bump protection. Suitable for small assembly gaps and fine-pitch interconnects, it is typically used as a pre-applied underfill to ensure optimal flow and reliable solder joint formation. The adhesive cures rapidly when exposed to heat.

Non-conductive, pre-applied underfill adhesive for thermal compression bonding

Low ionic contamination
Fast heat cure
Non-conductive
Provides excellent protection for electrical interconnections

Dry Ice Shipment, Shelf Life: 180 d