LOCTITE ABLESTIK ABP 2030SCR

LOCTITE® ABLESTIK ABP 2030SCR is a one-component, silver-filled, solvent-free die attach adhesive designed for high-throughput assembly of stress-sensitive semiconductors. It supports efficient thermal management and is ideal for bonding chips to a variety of substrates, particularly in sensitive electronic environments. For fast processing, it cures rapidly when exposed to heat.

Conductive die attach adhesive formulated for the assembly of stress-sensitive semiconductors.

Highly conductive
Fast curing
High viscosity
Low mechanical stress and moisture absorption
Solvent-free and low in halogens

Dry Ice Shipment, Shelf Life: 365 d