Why outgassing should be taken seriously
Gases can escape from both liquid and solid materials, which is known as outgassing and can lead to problems in the automotive industry, the electronics industry or the aerospace industry, among others. It can lead to a loss of performance and unreliability in certain components, which can have a negative impact on entire assemblies, devices and/or systems.
In order to keep outgassing in production as low as possible, certain manufacturers, such as Henkel, have special products in their range that are particularly low in outgassing and meet certain outgassing standards.
In the following article, we explain why outgassing should be taken seriously and which Loctite and Bergquist products from Henkel meet the NASA outgassing standard and the ASTM E595 standard.
How does outgassing occur?
Outgassing, i.e. the escape of gases from solid or liquid materials, can have various causes. For example, outgassing can occur due to pressure relief . Almost all materials outgas in a vacuum. This is because gas molecules have a tendency to move from an area of high pressure towards an area of low pressure, and in a vacuum there is an extremely low pressure level.
Outgassing can also occur due to an increase in temperature, as this leads to an increase in the kinetic energy of molecules, which become more volatile as a result, which can lead to a phase change to the gaseous state, both in liquid and solid materials.
Chemical, bacterial or radioactive conversion processes can also lead to outgassing.
There are four different mechanisms that can cause outgassing:
- Vaporization
- Diffusion
- Desorption
- Permeation
Evaporation occurs when a liquid or solid substance changes phase at the surface into a gaseous state.
During diffusion, gaseous molecules in a material move from the inside to the outside.
In the case of desorption, gas molecules are released that have accumulated on the surface, i.e. were adsorbed or absorbed.
Permeation is a form of outgassing in which gaseous molecules penetrate a material from the outside through the surface and then escape again at another point on the surface.
Problems due to outgassing
Outgassing causes problems in environments where the highest purity requirements apply, such as in semiconductor production. The outgassing substances can be water vapor, oil, grease or volatile organic compounds (VOCs). In particular, environments with vacuum and/or high temperatures pose special challenges for manufacturers of electronic devices, for example, which must also meet the highest cleanliness requirements in such environments.
However, outgassing can also lead to contamination of the materials used in other sectors, such as the automotive industry, and thus to performance losses and failures in electronic devices, such as sensors or control units.
The aerospace industry faces similar problems, as it cannot afford any loss of performance or even failures in electronic devices due to outgassing.
Measurement of outgassing
The US space agency NASA (National Aeronautics and Space Administration) has developed a technique for measuring outgassing due to the major challenges associated with it. ASTM E595 standard “Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment“). Basically, this is an outgassing test for materials in order to be able to decide whether these materials are suitable for use.
As the name of the ASTM E595 standard implies, the outgassing test of a specific material is used to test both the total mass loss and the amount of volatile, condensable substances collected during the test. The measurement result of the total mass loss is also referred to as the TML value, whereby TML is the abbreviation of the English term “Total Mass Loss”. Specifically, the TML value represents the percentage of the original mass loss of the tested material caused by the outgassing test, whereby the material is exposed to high temperatures and a vacuum during the test.
There is also a value for the measurement result of the collected volatile , condensable substances, namely the CVCM value, where CVCM is the abbreviation for “Collected Volatile Condensable Materials”. The CVCM value expresses the percentage of volatile substances that condense during outgassing, i.e. that change from the gaseous state to the condensed state during the outgassing test. To be acceptable as a material according to NASA or the ASTM E595 standard, the TML value determined in the outgassing test must be equal to or less than 1 percent, and the CVCM value must not exceed 0.1 percent.
Henkel products according to NASA outgassing standards
NASA and the ASTM E595 standard therefore place high demands on the outgassing of materials. The following Henkel Adhesives products from the Henkel brands Loctite and Bergquist meet the outgassing standards of NASA and theASTM E595 standard:
Electrically conductive pastes
| Product name | TML value | CVCM value | Tested curing time |
| LOCTITE® ABLESTIK 84-1LMI | 0.12 % | 0 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK 84-1LWITH | 0.14 % | 0.01 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK 8700E | 0.3 % | 0 % | 2 hours at 121 °C |
| LOCTITE® ABLESTIK 967-1 | 0.54 % | 0.01 % | 2 hours at 100 °C |
| LOCTITE® ABLESTIK 976-1 | 0.71 % | 0.1 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK 2902 | 0.64 % | 0.05 % | 18 hours at 25 °C |
| LOCTITE® ABLESTIK 57C A/B | 0.36 % | 0.03 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK CT5047-2 | 0.39 % | 0 % | 25 hours at 25 °C? |
| LOCTITE® ABLESTIK QMI 529HT-LV | 0.14 % | 0.03 % | 1 hour at 175 °C |
| LOCTITE® ABLESTIK 84-1LMINB | 0.09 % | 0.02 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK 84-1LMIT1 | 0.12 % | 0.01 % | 2 hours at 125 °C |
| LOCTITE® ABLESTIK 84-1LMINB1 | 0.14 % | 0.02 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK ICP 9000 | 0.2 % | 0.02 % | 2 hours at 120 °C plus 2 hours at 200 °C |
| LOCTITE® ABLESTIK CE3103WLV | 0.14 % | 0.02 % | 3 min. at 150 °C |
| LOCTITE® ABLESTIK 84-1LMISR4 | 0.36 % | 0.01 % | 1 hour at 175 °C |
| LOCTITE® ABLESTIK 71-1 | 0.25 % | 0 % | 0.5 hours at 150 °C plus 0.5 hours at 275 °C |
| LOCTITE® ABLESTIK 84-1LMIS | 0.26 % | 0.01 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK 56C/9 | 0.1 % | 0.01 % | 45 min. at 77 °C |
| LOCTITE® ABLESTIK 56C/11 | 0.31 % | 0.01 % | 3 hours at 100 °C |
| LOCTITE® ABLESTIK JM7000 | 0.15 % | 0.01 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK XCP3302NS | 0.18 % | 0.01 % | 2 hours at 170 °C |
| LOCTITE® ABLESTIK ICP3535M2 | 0.26 % | 0.03 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK ABP8064T | 0.25 % | 0.05 % | 1 hour at 180 °C |
| LOCTITE® ABLESTIK 8175 | 0.18 % | 0.01 % | 2 hours at 120 °C |
Source: Henkel AG & Co. KGaA
Encapsulant
| Product name | TML value | CVCM value | Tested curing time |
| LOCTITE® STYCAST 2762FT/17 | 0.2 % | 0.03 % | 3 hours at 121 °C |
| LOCTITE® STYCAST 2850FT/9 | 0.5 % | 0.01 % | 24 hours at 25 °C |
| LOCTITE® STYCAST 1090/9 | 0.46 % | 0.06 % | 30 days at 25 °C |
| LOCTITE® STYCAST 1090/11 | 0.49 % | 0.06 % | 24 hours at 100 °C |
| LOCTITE® STYCAST 1090SI/24LV | 0.74 % | 0.09 % | 16 hours at 25 °C |
| LOCTITE® STYCAST 2651/11 | 0.65 % | 0.06 % | 3 hours at 100 °C |
| LOCTITE® STYCAST 2651/23LV | 0.66 % | 0.03 % | 24 hours at 25 °C |
| LOCTITE® STYCAST 2651-40/9 | 0.31 % | 0.03 % | 16 hours at 25 °C |
| LOCTITE® STYCAST 2651-40/11 | 0.43 % | 0.01 % | 4 hours at 80 °C |
| LOCTITE® STYCAST 2651MM/9 | 0.35 % | 0 % | 3 days at 25 °C |
| LOCTITE® STYCAST 2850FT/11 | 0.36 % | 0 % | 1 hour at 120 °C |
| LOCTITE® STYCAST 2850FT/23LV | 0.58 % | 0.03 % | 24 hours at 25 °C |
| LOCTITE® STYCAST 2850FT/24LV | 0.45 % | 0 % | 24 hours at 25 °C |
Source: Henkel AG & Co. KGaA
Conformal Coatings
| Product name | TML value | CVCM value | Tested curing time |
| LOCTITE® STYCAST PC40-UMF | 0.87 % | 0.01 % | UV curing followed by 7 days at 25 °C |
Source: Henkel AG & Co. KGaA
Electrically conductive adhesive film
| Product name | TML value | CVCM value | Tested curing time |
| LOCTITE® ABLESTIK ECF561E | 0.38 % | 0.07 % | 2 hours at 120 °C |
| LOCTITE® ABLESTIK CF 3350 | 0.16 % | 0.03 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK CF 3366 | 0.39 % | 0.05 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK ECF 561 | 0.28 % | 0.1 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK 5025E | 0.3 % | 0.06 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK ECF550 | 0.49 % | 0.1 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK ECF568 | 0.44 % | 0.02 % | 2 hours at 95 °C |
| LOCTITE® ABLESTIK ECF563 | 0.21 % | 0.02 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK ECF564A | 0.3 % | 0.01 % | 2 hours at 150 °C |
| LOCTITE® ABLESTIK ECF564AHF | 0.3 % | 0.01 % | 2 hours at 150 °C |
Source: Henkel AG & Co. KGaA
Electrically insulated adhesive film
| Product name | TML value | CVCM value | Tested curing time |
| LOCTITE® ABLESTIK 5020K | 0.24 % | 0.02 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK 517 | 0.07 % | 0.01 % | 3 hours at 75 °C |
| LOCTITE® ABLESTIK 550 | 0.41 % | 0.01 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK 555 | 0.45 % | 0.06 % | 2 hours at 125 °C |
| LOCTITE® ABLESTIK 550K | 0.31 % | 0.04 % | 2 hours at 125 °C |
| LOCTITE® ABLESTIK 5020 | 0.74 % | 0.01 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK 563K | 0.44 % | 0.04 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK 568K | 0.66 % | 0.07 % | 2 hours at 95 °C |
| LOCTITE® ABLESTIK 563KN-02-012 | 0.52 % | 0.05 % | 1 hour at 150 °C |
| LOCTITE® ABLESTIK TBP 800 | 0.43 % | 0.01 % | not specified |
Source: Henkel AG & Co. KGaA
Underfillings
| Product name | TML value | CVCM value | Tested curing time |
| LOCTITE® ECCOBOND FP4545FC | 0.23 % | 0.01 % | 1 hour at 165 °C |
| LOCTITE® ECCOBOND UF 1173 | 0.43 % | 0.02 % | 5 min. at 150 °C |
| LOCTITE® ECCOBOND UF3811 | 0.45 % | 0.04 % | 1 hour at 100 °C |
| LOCTITE® ECCOBOND FP4531 | 0.2 % | 0.03 % | 7 min. at 160 °C |
| LOCTITE® ECCOBOND 3128 | 0.4 % | 0.01 % | 20 min. at 80 °C |
Source: Henkel AG & Co. KGaA
Electrically non-conductive pastes
| Product name | TML value | CVCM value | Tested curing time |
| LOCTITE® ABLESTIK 281 | 0.46 % | 0.01 % | 0.5 hours at 150 °C |
| LOCTITE® ABLESTIK 642-1 | 0.71 % | 0 % | 2 hours at 75 °C |
| LOCTITE® ABLESTIK 84-3 | 0.42 % | 0.02 % | 2 hours at 125 °C |
| LOCTITE® ABLESTIK 2151 | 0.49 % | 0.07 % | 4 hours at 65 °C |
| LOCTITE® ABLESTIK 789-3 | 0.46 % | 0 % | 4 hours at 100 °C |
| LOCTITE® ABLESTIK 789-4 | 0.44 % | 0.01 % | 1 hour at 125 °C |
| LOCTITE® ABLESTIK 8700K | 0.59 % | 0 % | 2 hours at 121 °C |
| LOCTITE® ABLESTIK 104 | 0.52 % | 0.08 % | 6 hours at 120 °C |
| LOCTITE® ABLESTIK 285/11 | 0.28 % | 0.01 % | 8 hours at 82 °C |
| LOCTITE® ABLESTIK 285/23LV | 0.93 % | 0.02 % | 7 days at 25 °C |
| LOCTITE® ABLESTIK 285/9 | 0.29 % | 0 % | 7 days at 25 °C |
| BERGQUIST® LIQUI BOND TLB SA3500 | 0.41 % | 0.06 % | not specified |
| BERGQUIST® LIQUI BOND TLB EA1800 | 0.58 % | 0.01 % | 25 °C, 24 hours |
Source: Henkel AG & Co. KGaA
Thermal interface materials – gap fillers
| Product name | TML value | CVCM value | Tested curing time |
| BERGQUIST® GAP FILLER TGF 1400SL | 0.08 % | 0.03 % | not specified |
| BERGQUIST® GAP FILLER TGF 1500 | 0.41 % | 0.05 % | not specified |
| BERGQUIST® GAP FILLER TGF 1500LVO | 0.08 % | 0.01 % | not specified |
| BERGQUIST® GAP FILLER TGF 3600 | 0.84 % | 0.05 % | not specified |
| BERGQUIST® GAP FILLER TGF 3500LVO | 0.04 % | 0.02 % | not specified |
| BERGQUIST® GAP FILLER TGF 4000 | 0.27 % | 0.07 % | not specified |
| LOCTITE® TGEL 6000 | 0.07 % | 0.02 % | not specified |
| BERGQUIST® LIQUI FORM TLF LF3500 | 0.21 % | 0.05 % | not specified |
| BERGQUIST® LIQUI FORM TLF 3500CGEL | 0.07 % | 0.02 % | not specified |
| BERGQUIST® LIQUI FORM TLF 3800LVO | 0.05 % | 0.02 % | not specified |
| BERGQUIST® LIQUI FORM TLF 5800LVO | 0.04 % | 0.01 % | not specified |
| BERGQUIST® LIQUI FORM TLF 6000HG | 0.16 % | 0.03 % | not specified |
Source: Henkel AG & Co. KGaA
Thermal interface materials – Gap Pad
| Product name | TML value | CVCM value | Tested curing time |
| BERGQUIST® GAP PAD TGP 1000HD | 0.37 % | 0.1 % | not specified |
| BERGQUIST® GAP PAD TGP 3000 | 0.65 % | 0.03 % | not specified |
| BERGQUIST® GAP PAD TGP 5000 | 0.85 % | 0.1 % | not specified |
| BERGQUIST® GAP PAD TGP HC3000 | 0.11 % | 0.04 % | not specified |
| BERGQUIST® GAP PAD TGP HC5000 | 0.05 % | 0.01 % | not specified |
| BERGQUIST® GAP PAD TGP 1000VOUS | 0.13 % | 0.02 % | 24 h/200 °C/air |
| BERGQUIST® GAP PAD TGP 12000ULM | 0.27 % | 0.07 % | not specified |
| BERGQUIST® GAP PAD TGP 3500ULM | 0.07 % | 0.02 % | not specified |
| BERGQUIST® GAP PAD TGP 3500ULMG | 0.07 % | 0.02 % | not specified |
| BERGQUIST® GAP PAD TGP 6000ULM | 0.04 % | 0.01 % | not specified |
| BERGQUIST® GAP PAD TGP 7000ULM | 0.03 % | 0.03 % | not specified |
| BERGQUIST® GAP PAD TGP 10000ULM | 0.1 % | 0.05 % | not specified |
| BERGQUIST® GAP PAD TGP 3004SF | 0.14 % | 0.01 % | not specified |
| BERGQUIST® GAP PAD TGP EMI1000 | 0.22 % | 0.06 % | not specified |
Source: Henkel AG & Co. KGaA
Thermal interface materials – Sil Pad
| Product name | TML value | CVCM value | Tested curing time |
| BERGQUIST® SIL PAD TSP K1300 | 0.36 % | 0.09 % | 10 min./ 145 °C/ air |
| BERGQUIST® SIL PAD TSP 1600S | 0.25 % | 0.08 % | not specified |
| BERGQUIST® SIL PAD TSP 1800 | 0.18 % | 0.05 % | not specified |
| BERGQUIST® SIL PAD TSP 1800ST | 0.23 % | 0.05 % | not specified |
| BERGQUIST® SIL PAD TSP A2000 | 0.2 % | 0.04 % | not specified |
| BERGQUIST® SIL PAD TSP 3500 | 0.07 % | 0.03 % | 24 h/175 °C/air |
| BERGQUIST® SIL PAD TSP A3000 | 0.38 % | 0.03 % | not specified |
| BERGQUIST® SIL PAD TSP Q2500 | 0.06 % | 0.02 % | 24 hours / 175 °C / air |
Source: Henkel AG & Co. KGaA
Here you will find a wide range of Henkel products in the abovo online store.
Advice on Henkel products with low outgassing
For more than 15 years, the Swiss specialist wholesaler abovo has been an authorized distributor for the Henkel Adhesive Technologies division Henkel Elektronik (Henkel Electronic Material) and, since 2022, also for the Henkel Industrial division.
We will be happy to advise you if you have any questions about Henkel Adhesives products of the Henkel brands Loctite and Bergquist as well as with regard to the outgassing standards of NASA or theASTM E595 standard.
Contact our Henkel experts simply and without obligation by phone or e-mail:
- Telephone number: +41 32 552 44 44
- E-mail: info@abovo.ch
