LOCTITE ECCOBOND UF 3812

If you're looking for a halogen-free underfill that shows stable performance under thermal stress, consider LOCTITE ECCOBOND UF 3812. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. Our ECCOBOND UF 3812 solution can be used with most Pb-free solders; is designed for the production of CSPs, WLCSPs, and BGAs; and is formulated to flow at room temperature with no additional preheating required.

One-part epoxy underfill with excellent thermal performance

Dry Ice Shipment, Shelf Life: 180 d

STK