LOCTITE ECCOBOND UF 3812
Beschreibung:
UF 3812
Details:
LOCTITE ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
- Halogen-free
- Low viscosity material flows at room temperature with no additional preheating required
- High Tg and high fracture toughness enable excellent protection of solder joints during thermal cycling
- Room temperature flow capability
- Halogen-free
- Low viscosity material flows at room temperature with no additional preheating required
- High Tg and high fracture toughness enable excellent protection of solder joints during thermal cycling
- Room temperature flow capability
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 180 d
Verkaufseinheit:
STK
