LOCTITE ECCOBOND UF 3810
Beschreibung:
UF3810(-20DC), Underfill
Details:
LOCTITE ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
- Fast cure at moderate temperatures
- Halogen free
- High Tg
- Compatible with most Pb-free solders
- Fast cure at moderate temperatures
- Halogen free
- High Tg
- Compatible with most Pb-free solders
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 365 d
Verkaufseinheit:
STK
