LOCTITE ECCOBOND UF 3800
Beschreibung:
UF3800
Details:
LCTITE ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
- Reworkable
- High Tg
- Room temperature flow capability
- Fast cure at moderate temperatures
- Reworkable
- High Tg
- Room temperature flow capability
- Fast cure at moderate temperatures
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 270 d
Verkaufseinheit:
STK
