LOCTITE ECCOBOND UF 3800
LCTITE ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
- High Tg
- Room temperature flow capability
- Fast cure at moderate temperatures
Dry Ice Shipment, Shelf Life: 270 d