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LOCTITE ECCOBOND FP4531

Beschreibung:

FP4531



Details:
If you’re looking for an underfill to increase the reliability of small-gap flip-chips, consider LOCTITE® ECCOBOND FP4531™. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications via capillary action. LOCTITE® ECCOBOND FP4531™ has a recommended snap-cure schedule of 7 minutes at 320°F (160°C) and passes NASA outgassing standards.

One-part underfill compatible with small gap sizes

- Compatible with small gap sizes
- Snap-curable
- Fast flow
- Passes NASA outgassing
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 270 d
Verkaufseinheit:
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