LOCTITE ECCOBOND FP4323
Beschreibung:
FP4323 -40CD
Details:
LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
- Low CTE for improved thermal cycling
- High purity
- Thixotropic
- Excellent moisture resistance
- Low CTE for improved thermal cycling
- High purity
- Thixotropic
- Excellent moisture resistance
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 270 d
Verkaufseinheit:
STK
