LOCTITE ABLESTIK 8387B
Details:
LOCTITE ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC.
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 365 d