LOCTITE ABLESTIK 8387B

Non-conductive die attach 8387B

LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC. Please refer to the TDS for alternate cure schedules.

- Black pigmentation for blocking stray light
- Non-conductive
- Fast cure

Dry Ice Shipment, Shelf Life: 365 d

STK