LOCTITE 3563

Beschreibung:

LOC 3563 Underfill -40CD

Details:

LOCTITE 3563 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.

- Production - high speed curing
- One component - requires no mixing
- Fast flowing epoxy liquid

Verpackungsdetails:

Dry Ice Shipment, Shelf Life: 365 d

Verkaufseinheit:

STK