TECHNOMELT PA 2302 BLACK
Détails:
A 1-part, low-viscosity, thermoplastic hot melt adhesive specially designed for molding applications.
TECHNOMELT PA 2302 BLACK is a 1-part polyamide hot melt adhesive formulated for molding processes. Its low viscosity makes it ideal for encapsulating fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment. Ideal for potting electronics modules, molding strain relief into wiring, and encapsulation of sensors. A versatile adhesive for a variety of substrates.
Détails d'emballage:
Ambient non frozen Shipment, Shelf Life: 730 d