LOCTITE ECCOBOND DAM 7010C

LOCTITE ECCOBOND DAM 7010C is a black, non-sag dam encapsulant, for use with a fill encapsulant such as LOCTITE® ECCOBOND FIL 7010C, for protecting multiple chips and for encapsulating components that require a well-defined glob height and a flat surface. It’s particularly ideal for glob top applications where protection of wire-bonded bare IC is required. It is formulated with an epoxy-based resin and cures when exposed to heat.

Thermally resistant dam encapsulant for glob top applications

Dry Ice Shipment, Shelf Life: 183 d

STK