LOCTITE ECCOBOND 50300HT

Eccobond 50300HT glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use. It is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled.

Dry Ice Shipment, Shelf Life: 122 d

STK