LOCTITE 3517M

If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE 3517M is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE 3517M is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.

One-part, black epoxy underfill for preventing mechanical stress

Blue Ice Shipment, Shelf Life: 365 d

STK