LOCTITE ECCOBOND UF 3810

LOCTITE ECCOBOND UF 3810 is a one-component, reworkable epoxy-based underfill material specifically designed for CSP and BGA applications. It cures rapidly at moderate temperatures to minimize stress on other components and provides excellent mechanical protection of solder joints under thermal cycling conditions after curing. Stable electrical performance can also be expected even in high-humidity environments.

Reworkable epoxy-based underfill material with fast curing at moderate temperatures

Fast curing at moderate temperatures
Halogen-free
High glass transition temperature
Compatible with most lead-free solders
Room-temperature flowability

Dry Ice Shipment, Shelf Life: 365 d