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LOCTITE ECCOBOND UF 8830S

Beschreibung:

LOCTITE ECCOBOND UF 8830S 30CC



Details:

LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.

When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.

Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 365 d
Verkaufseinheit:
STK
Auswahl zurücksetzen
Menge: