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LOCTITE ECCOBOND UF 3811 30CC

Beschreibung:

LOC ECCOBOND UF 3811



Details:

LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.

Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 365 d
Verkaufseinheit:
STK
Auswahl zurücksetzen
Menge: