LOCTITE ECCOBOND UF 1173
Beschreibung:
2nd Level Underfill
Details:
LOCTITE ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173 material is compliant with REACH SVHC toxicity-free and CMR-free legislative requirements. As per current, June 2018 REACH SVHC documentation.
- One component
- Void-free underfill
- Low CTE
- Long pot life
- One component
- Void-free underfill
- Low CTE
- Long pot life
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 180 d
Verkaufseinheit:
STK
