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LOCTITE ECCOBOND UF 1173

Beschreibung:

2nd Level Underfill



Details:

LOCTITE ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.

LOCTITE ECCOBOND UF 1173 material has been formulated without any reportable REACH SVHCs (current to June 2018) and the product is not CMR classified.

Verpackungsdetails:
Dry Ice-Barrier Pkg Shipment, Shelf Life: 180 d
Verkaufseinheit:
STK
Auswahl zurücksetzen
Menge: