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LOCTITE ECCOBOND FP4549HT

Beschreibung:

HYSOL FP4549HT 10CC UF -40CD



Details:

LOCTITE ECCOBOND FP4549HT liquid epoxy is designed for enhanced adhesion to integrated circuit passivation materials, and flex circuits. This material is formulated to quickly underfill devices at 90°C to 110°C substrate temperature, with as little as a 2 mil gap. When fully cured, LOCTITE ECCOBOND FP4549HT forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.

Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 270 d
Verkaufseinheit:
STK
Auswahl zurücksetzen
Menge: