LOCTITE ECCOBOND FP 5201

LOCTITE ECCOBOND FP 5201

Beschreibung:

FP5201 16G

Details:

LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly.

Verpackungsdetails:

Dry Ice Shipment, Shelf Life: 365 d

Verkaufseinheit:

STK