LOCTITE ECCOBOND FP 5201
Beschreibung:
FP5201 16G
Details:
LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly.
Verpackungsdetails:
Dry Ice Shipment, Shelf Life: 365 d
Verkaufseinheit:
STK
FP5201 16G
