LOCTITE 3609
Beschreibung:
Chipbond Epoxy Adhesive
Details:
If you’re looking for a surface mount adhesive with medium to high dispense speeds, choose LOCTITE 3609. This epoxy based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead free wave solder with both water-based and alcohol-based fluxes.
Medium to high dispense speed, non-conductive, surface mount adhesive
- Medium to high dispense speeds
- 1-part
- Electrically non-conductive
- Surface mount adhesive
Medium to high dispense speed, non-conductive, surface mount adhesive
- Medium to high dispense speeds
- 1-part
- Electrically non-conductive
- Surface mount adhesive
Verpackungsdetails:
Blue Ice/Cold pack Shipment, Shelf Life: 270 d
Verkaufseinheit:
STK
