ECCOBOND D 125 F 3 DR 10G SEL
ECCOBOND D 125 F 3 DR is a one component, low temperature curing surface mount adhesive which applies easily without stringing. It will not sag during cure. The uncured product has no moisture absorption and corrosion after cure is not observed. This single component adhesive cures in 2,5 minutes at 120°C in IR and prevents component movement during board handling or cure.
ECCOBOND D 125 F 3 DR is an excellent adhesive for bonding a complete range of components including chip capacitors and resistors, SOT's, SOIC's and PLCC's.