LOCTITE ECCOBOND FP4531
Description:
FP4531
Détails:
If you’re looking for an underfill to increase the reliability of small-gap flip-chips, consider LOCTITE® ECCOBOND FP4531™. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications via capillary action. LOCTITE® ECCOBOND FP4531™ has a recommended snap-cure schedule of 7 minutes at 320°F (160°C) and passes NASA outgassing standards.
One-part underfill compatible with small gap sizes
- Compatible with small gap sizes
- Snap-curable
- Fast flow
- Passes NASA outgassing
One-part underfill compatible with small gap sizes
- Compatible with small gap sizes
- Snap-curable
- Fast flow
- Passes NASA outgassing
Détails d'emballage:
Dry Ice Shipment, Shelf Life: 270 d
Unité de vente:
STK
