LOCTITE ECCOBOND UF 3811

LOCTITE® ECCOBOND UF 3811 is a halogen-free, reworkable, low-viscosity epoxy underfill designed specifically for BGA and CSP applications. It flows at room temperature without additional preheating and cures quickly at moderate temperatures to minimize stress on other components. After curing, it provides a high glass transition temperature while remaining flexible to protect solder joints during temperature cycling and drop testing.

Halogen-free, low-viscosity, reworkable underfill

Flows at room temperature
Low viscosity
High glass transition temperature (Tg)
Fast curing at moderate temperatures
No preheating required

Dry Ice Shipment, Shelf Life: 365 d